AM Campus 2.0 Event Series continues with design and optimization of products for additive manufacturing

AM Campus 2.0 Event Series continues with design and optimization of products for additive manufacturing

The AM Campus 2.0 Event Series aims at increasing the understanding and knowledge of additive manufacturing in companies. The Event Series is organized by Wärtsilä, DIMECC and Merinova Technology Centre and it concentrates on practical training. The series continues November 9-10th with the second event “Advanced DfAM (design for additive manufacturing) – Take your engineering design and workflow skills to the advanced AM era”. The instruction is given by the experts of nTopology, the University of Vaasa and the companies of FAME Ecosystem.

The second event will focus on the tools primarily aimed at the design and optimization of products for additive manufacturing. Through a combination of best-in-class examples of topology optimization, lattice structures integration and field driven design, the participants will master everything they need to work effectively with nTopology software. The full capabilities of the software are practiced with hands-on-exercises, tutorials, and facilitators guides.

AM Campus 2.0 event series started October 6th with the first hands-on training session. The first event gathered engineers from ten companies to focus on learning what additive manufacturing means in practice. The second event will be a more advanced training for designers, focusing on how to optimate the design to get the best out of AM.

The AM Campus 2.0 Event Series consists of three parts, which are FREE for participants, and it takes place during autumn 2022. The series takes place at Wärtsilä Sustainable Technology Hub in Vaasa.

The AM Campus 2.0 Event Series event number 2 “Advanced DfAM – Take your engineering design and workflow skills to the advanced AM era”

Location: Wärtsilä Sustainable Technology Hub (Reininkatu 3, 65170 Vaasa)

Date and time: 9-10 Nov. 2022 at 9 AM-5 PM

Registration link: https://link.webropol.com/ep/amcampusevent2

More information

Dr. Rayko Toshev, rayko.toshev@uwasa.fi +358408485994

Ecosystem Lead Markus Korpela, markus.korpela@dimecc.com +358 40 840 5660

Ecosystem Lead Eetu Holstein, eetu.holstein@dimecc.com +358 40 840 8660

AM Campus 2.0 is a concept where Finnish industrial companies can conduct experiments and research in the field of 3D printing in shared spaces. AM Campus 2.0 is physically located in the premises of Wärtsilä’s Sustainable Technology Hub, where a modern 3D printer based on metal powder bed technology will be purchased. Companies can operate this printer with the help of an operator, allowing the company’s engineers to become familiar with the technology.